1 ATR 8-Slots 3U VME/VPX or cPCI With Forced-Air Cooling

Viper II

Macrolink’s ML1000TFACC is a conduction-cooled, 8-Slot 3U VME/VPX or cPCI rugged enclosure designed for avionics and ground vehicle applications. The structure is capable of withstanding extreme environmental conditions of altitude, temperature, humidity, shock, vibration, EMI, and chemical exposure.

ML-1000TFACC Series Tall Forced-Air Conduction-Cooled Air Transport Rack Electronic Equipment Enclosure

  • ML1000TFACC is optimized to provide maximum strength with minimum weight. Lightweight aluminum 6061-T6 provides robust Faraday shielding protection for electronic payload. Removable panels use stainless steel captive hardware and self-locking helicoils for maximum shock and vibration security. A modular plug-in power supply supports low Mean Time To Repair service.
  • Conduction cooling is through precision-machined card guides in the sidewalls. Both circuit card assemblies and power supply heat are conducted through this inner structural member, then to the mounting interface. A 63 micro-inch surface finish reduces the thermal resistance path between mounting interfaces.

    Macrolink’s in-house thermal analysis capabilities dramatically shorten the delivery time of any completed system by eliminating the risk of project failure due to overheating. Through analyzation of a variety of heat transfer regimes – conduction, convection (natural, mixed, forced), conjugate (simultaneous conduction and convection), radiation – and implementation, a solution is presented based on specific board requirements, assuring early in the design process that the product’s thermal requirements have been satisfied.

    Native, solid-model CAD geometry is utilized to produce a selection of shaded display, particle trace animation, and clipping planes to optimize thermal performance and validate design.


  • The integral front panel accommodates MIL style M38999 connectors with high-density internal connectors and is customized, along with the backplane, to meet each customer’s unique requirements. Front panel options include:

    • Elapse time indicator
    • Ground stud – inside front panel (.250-20 UNC)
    • Status LED indicators
  • The enclosure is chromate conversion coated per MIL-C-5541 Class 3 for maximum protection against corrosion on all surfaces, then the exterior is epoxy-painted to military standards and colors. For space applications, Anodic Coating per MIL-A-8675 Type I is used. All materials and finishes are fungus resistant.
  • The ML1000TFACC accommodates 8 standard VME/VPX or cPCI boards, including a power supply, with 0.8″ pitch:

    • IEEE 1101.2 conduction-cooled cards
    • Optional board spacing available upon request
  • Backplane is cPCI complaint, PICMG 2.0 R3.0, with five-row, 160-pinned J1, J2 connectors with P0 80 pin connectors in all slots. Any of the pins in rows A and C and user defined. Pins in rows Z and D of the J2 connectors as well as the 95 I/O pins on P0 connectors can be routed to the front I/O panel.

    Optional VME per ANSI/VITA 1.1-1997 standard also available.


  • 10.63″ W x 10.93″ H x 13.19″ L
Operating Temperature
  • -50°C to +80°C
Storage Temperature
  • -55°C to 125°C
Power supply specifications
  • Input power +28 V nominal (14 to 32 V steady state) transients 16 to 80 VDC
  • EMI/RFI Meets emissions and susceptibility per MIL-STD-461C, CE01, CE03, CS01, CS06 and RE02
  • Output power:
Output 1 2 3 4
Volts DC +3.3 +5 +12 -12
Amps 13.74 10 4.5 1.0
Line/Load regulation % 0.06 0.2 0.02 0.02
Ripple/Noise (P-P mV)  150 mV 150 mV 100 mV 100 mV
  • MIL-STD-810E Method 514.4 Procedure 1, Cat. 4 propeller, Cat. 5 jet aircraft, Cat. 6 helicopter
  • 0.1 g2/Hz, 15-2000 Hz hard mount
  • MIL-STD-810 Method 516.4 Procedure 1 20g, 1/2 sine, 11 msec
  • 50,000 feet per RTCA-D0-160D Section 4.0, Category D2