10/18-Slot Shock Isolated Extreme Environment 6U VME/VPX or CompactPCI

The Macrolink Puma is a superior-quality, rugged chassis designed to meet the extreme environmental demands of field-fixed and severe mobile applications. Drawing on decades of design and field deployment experience, the Puma is crafted to provide maximum configuration flexibility, long life, and dependable service with minimal maintenance.

ML-1900 Series Puma 18/10-Slot Convection Cooled Electronic Equipment Enclosure

A precise blend of machined, formed, and extruded members impart an exceptional degree of structural integrity, while significantly reducing the number of mechanical fasteners for increased reliability and ease of access to Field Replaceable Units (FRUs). Both the card cage and the peripheral bay are shock isolated to meet the rigors of harsh deployment environments.

System boards are easily accessed through the main hinged chassis door, while the peripherals can be rapidly accessed through a hinged sub-door via a pair of finger-operated, quarter-turn latches. Maximum peripheral door protrusion into operator space is a mere 7.25 inches. All internal and external surfaces are chromate conversion coated with a powder-coated exterior finish providing maximum protection against corrosion. All materials and finishes meet fungus and salt atmosphere resistance per MIL-STD-810E.

The Puma’s all-metal card cage assembly accepts 18 6U VME or cPCI boards into a monolithic backplane, and 10 boards with the peripheral bay installed. The peripheral bay houses up to five fixed or removable half-height SAS/SATA devices. The peripheral bay can also be configured with up to four high-cycle, shock-isolated, removable SCSI drive modules for more rigorous deployments.

Ample, unrestricted, free space is provided to the rear of the backplane for paddle cards, sub-racks, and discreet backplane to I/O bulkhead cabling. Over 70 square inches of I/O panel space accommodates the densest of I/O configurations.

An oversized, filtered air intake and precise baffling, combined with high-efficiency fans, insures generous airflow through the card cage and peripheral bay. A sophisticated thermal management option extends the Puma’s deployment capability to operating environments reaching -20°C ambient.

Complete EMI/RFI integrity is maintained via conductive interior surfaces, braided gasketing on all moveable panels and front doors, conductive gasketing on all mating joints, and honeycomb-shielded vent screens front and rear.

Macrolink’s Puma is an ideal chassis to meet the stringent demands of most airborne, field-fixed, naval surface, and ground mobile deployments at an affordable price – with maximum configurability – and the reduced delivery times expected of COTS enclosures.


Construction & Finish
  • Heavy gauge brazed 6061/T6 aluminum per MIL-B-7883
  • All internal/external surfaces chromate conversion coated per MIL-C-5541 Grade A Class 3
  • All external surfaces gray powder coated per FED-STD-595B26081
  • Other color/finishes available
Card Cage Assembly
  • All metal, shock/vibration isolated, card cage assembly
  • IEEE 1101.10 compliant
  • Card access via hinged front door
  • Two to 10-Slot monolithic VME, VME64X, VPX (with or without J0) or cPCI (J1-J5) backplane
  • 80mm mid-plane card cage option
  • Auto Bus Grant
  • Accepts 18 6U VME/VPX
  • 3.54″ (90mm) card cage set-back
  • Split, multiple, or custom VME/VPX/cPCI backplanes
  • H.110 option
Switches & Indicators
  • Power mains with circuit breaker on rear bulkhead
  • Protected DC Power Enable switch on front panel
  • Power OK indicator – Green
  • Fan Fail indicator – Red
  • Optional Elapsed Time Indicator (reads to minimum 9,999 hrs.)
  • Heaters On indicator (for thermal management option)
  • Battle Short switch and indicator option
Power Supply
  • 250 W to 1000 W
  • Heavy duty, high-efficiency supplies
  • Universal AC input; 50/60/400 Hz; .99 PFC
  • +5/+12/-12/+3.3 VDC outputs
  • 1 to 4 additional VDC output options
  • N+1 load-sharing option
  • 28 VDC or 48 VDC input options
External Power Connector
  • MS3470L12-3P on rear bulkhead for AC IN
  • MS27505E21F-11P on rear bulkhead for DC IN
  • Other MS power connector options
  •  IEC 321 or custom connectors
Chassis I/O
  • 4.85″ H (123mm) x 13.83″ W (351mm) rear I/O panel space
  • 10″ of unimpeded clearance between backplane and rear chassis bulkhead
  • Blank I/O panel with textured powder coat finish standard
  • Custom I/O panels with cutouts, silkscreen, connectors, and/or cable assemblies available
Peripheral Support
  • Shock/vibration isolated peripheral housing
  • One to five fixed/removable SAS/SATA half-height 2.5″ spinning or 2.5″ SSD drives
  • One to eight shock-isolated removable High-Cycle (HC) SAS/SATA spinning or SSD disk drives
  • Single, split, or multiple peripheral busses
  • Peripherals rapidly accessible via hinged, front panel door
EMI/RFI Integrity
  • Braided gasket on all moveable surfaces
  • Conductive gasket on all mating joints
  • Honeycomb vent screens front and rear
  • EMI/EMC shielding meets JASA standards
  • 15.72” H (399mm) x 19.00” W (483mm) x 24.87” L (631mm), including front and rear handles
  • 19″ rackmount per EIA-310D
  • 45 lbs. to 97 lbs.; configuration dependent
  • Evacuative, filtered, forced-air with rear discharge
  • 340 cfm (free air)
  • >300 lfm per slot
  • High-pressure/high-altitude fan option
  • Washable/replaceable particulate filters
Ambient Temperature
  • Operating: -40ºC to 50ºC
  • Operating: -40ºC to 50ºC with thermal management option
  • Storage: -40ºC to +75°C
  • 0% to 95%, non-condensing
  • >80,000 P.O.H.
  • <.5 hours for any Field Replaceable Unit (FRU)
Environmental Qualifications Designed to meet:

  • MIL-STD-167
  • MIL-STD-810E
  • MIL-STD-901D
  • MIL-STD-704
  • MIL-STD-461D
Part Number 530110