3/4 ATR 6-9 slot VME/VPX or cPCI

Black Eagle

Macrolink’s ML-750FACC is a conduction-cooled, 6 -9 Slot VME/VPX/ cPCI rugged enclosure designed for avionics, ground vehicles, and space applications. The structure is capable of withstanding extreme environmental conditions of altitude, temperature, humidity, shock, vibration, EMI, and chemical exposure. System includes removable high cycle shuttleized SSDs

ML-750FACC Series Forced Air Conduction Cooled Air Transport Rack Electronic Equipment Enclosure

  • ML750FACC is optimized to provide maximum strength with minimum weight. Lightweight aluminum 6061-T6, brazed per MIL-B-7883, minimizes the need for fasteners and provides robust Faraday shielding protection for electronic payload. Removable panels use stainless steel captive hardware and self-locking helicoils for maximum shock and vibration security. A modular plug-in power supply supports low Mean Time To Repair service.
  • Conduction cooling is through precision-machined card guides in the sidewalls. Both circuit card assemblies and power supply heat are conducted through this brazed inner structural member, then to the mounting interface. A 63 micro-inch surface finish reduces the thermal resistance path between mounting interfaces.

    Macrolink’s in-house thermal analysis capabilities dramatically shorten the delivery time of any completed system by eliminating the risk of project failure due to overheating. Through analyzation of a variety of heat transfer regimes – conduction, convection (natural, mixed, forced), conjugate (simultaneous conduction and convection), radiation – and implementation, a solution is presented based on specific board requirements, assuring early in the design process that the product’s thermal requirements have been satisfied.

    Native, solid-model CAD geometry is utilized to produce a selection of shaded display, particle trace animation, and clipping planes to optimize thermal performance and validate our design.
    BlackEagleThermal

  • The integral front panel accommodates MIL style M38999 connectors with high-density internal connectors and is customized, along with the backplane, to meet each customer’s unique requirements. Front panel options include:

    • Elapse time indicator
    • Ground stud (.250-20 UNC)
    • Status LED indicators
  • The enclosure is chromate conversion coated per MIL-C-5541 Class 1A for maximum protection against corrosion on all surfaces, then the exterior is epoxy-painted to military standards and colors per MIL-HDBK-1568. For space applications, Anodic Coating per MIL-A-8675 Type I is used. All materials and finishes are fungus resistant.
  • The ML750FACC accommodates 6-9 standard VME/VPX/cPCI boards, including a power supply:

    • IEEE 1101.2 conduction cooled cards
    • Optional board spacing available upon request
  • Backplane is PICMG 2.0 R3.0, with five-row, 220-pinned J1, J2 connectors in all slots. Any of the J2 pins can be routed to the front I/O panel.

Specifications

Dimensions
  • 7.50″ W x 7.625″ H x 14.00″ L
Operating Temperature
  • -40°C to +55°C
Storage Temperature
  • -55°C to 125°C
Power supply specifications
  • Input power 28 VDC nominal
  • EMI/RFI Meets emissions and susceptibility per MIL-STD-461E, CE01, CE03, CE102, CS01, CS06, CS101, CS102, CS115, CS116 and RE02
  • Output Power:
Output 1 2 3 4
Volts DC +3.3 +5 +12 -12
Amps 8 36 0.25 0.25
Line/Load regulation % 0.06 0.2 0.02 0.02
Ripple/Noise (P-P mV)  66 mV 100 mV 120 mV 120 mV
Vibration
  • MIL-STD-810E Method 514.4 Procedure 1, Cat. 4 propeller, Cat. 5 jet aircraft Cat. 6 helicopter
  • 0.1 g2/Hz, 15-2000 Hz hard mount
Shock
  • MIL-STD-810 Method 516.4 Procedure 1 20 g, 1/2 sine, 11 msec
Decompression
  • Unit shall withstand and perform as specified during a pressure change from 8,000 feet to 35,000 feet within 15 seconds
  • At 41,000 feet, the unit will perform as specified for 10 minutes at full load
Humidity
  • MIL-STD-810E Method 507.4
Fungus
  • MIL-STD-810E Method 507.4
Salt Fog
  • MIL-STD-810E Method 507.4