25 Industrial Boulevard
Medford, NY 11763
Director of Business Development
Email Jim ›
Macrolink’s ML-750FACC is a conduction-cooled, 6 -9 Slot VME/VPX/ cPCI rugged enclosure designed for avionics, ground vehicles, and space applications. The structure is capable of withstanding extreme environmental conditions of altitude, temperature, humidity, shock, vibration, EMI, and chemical exposure. System includes removable high cycle shuttleized SSDs
Conduction cooling is through precision-machined card guides in the sidewalls. Both circuit card assemblies and power supply heat are conducted through this brazed inner structural member, then to the mounting interface. A 63 micro-inch surface finish reduces the thermal resistance path between mounting interfaces.
Macrolink’s in-house thermal analysis capabilities dramatically shorten the delivery time of any completed system by eliminating the risk of project failure due to overheating. Through analyzation of a variety of heat transfer regimes – conduction, convection (natural, mixed, forced), conjugate (simultaneous conduction and convection), radiation – and implementation, a solution is presented based on specific board requirements, assuring early in the design process that the product’s thermal requirements have been satisfied.
Native, solid-model CAD geometry is utilized to produce a selection of shaded display, particle trace animation, and clipping planes to optimize thermal performance and validate our design.
The integral front panel accommodates MIL style M38999 connectors with high-density internal connectors and is customized, along with the backplane, to meet each customer’s unique requirements. Front panel options include:
The ML750FACC accommodates 6-9 standard VME/VPX/cPCI boards, including a power supply:
|Power supply specifications||