3/4 ATR 4-Slot VME/VPX/cPCI Liquid Sidewall Cooled

Macrolink’s ML750CCM is a conduction-cooled, 4-Slot VME/VPX or cPCI rugged enclosure designed for avionics, ground vehicles, and space applications. The structure is capable of withstanding extreme environmental conditions of altitude, temperature, humidity, shock, vibration, EMI, and chemical exposure.

ML-750CCM Series Liquid Sidewall Conduction Cooled ATR Cold Plate Mount Electronic Equipment Enclosure

  • ML750CCM is optimized to provide maximum strength with minimum weight. Lightweight aluminum 6061-T6, brazed per MIL-B-7883, minimizes the need for fasteners and provides robust Faraday shielding protection for electronic payload. Removable panels use stainless steel captive hardware and self-locking helicoils for maximum shock and vibration security. A modular plug-in power supply supports low Mean Time To Repair service.
  • Liquid sidewall cooling is passed through precision-machined card guides in the sidewalls. Both circuit card assemblies and power supply heat are conducted through this brazed inner structural member, then to the mounting interface. A 63 micro-inch surface finish reduces the thermal resistance path between mounting interfaces.

    Macrolink’s in-house thermal analysis capabilities dramatically shorten the delivery time of any completed system by eliminating the risk of project failure due to overheating. Through analyzation of a variety of heat transfer regimes – conduction, convection (natural, mixed, forced), conjugate (simultaneous conduction and convection), radiation – and implementation, a solution is presented based on specific board requirements, assuring early in the design process that the product’s thermal requirements have been satisfied.

    Native, solid-model CAD geometry is utilized to produce a selection of shaded display, particle trace animation, and clipping planes to optimize thermal performance and validate our design.ML750CCMthermal

  • The integral front panel accommodates MIL style M38999 connectors with high-density internal connectors and is customized, along with the backplane, to meet each customer’s unique requirements.
  • The enclosure is chromate conversion coated per MIL-C-5541 Class 3 for maximum protection against corrosion on all surfaces, then the exterior is epoxy-painted to military standards and colors. For space applications, Anodic Coating per MIL-A-8675 Type I is used. All materials and finishes are fungus resistant.
  • The ML750CCM accommodates four 3U VME/VPX or cPCI boards, including a power supply, with 0.8″ pitch:

    • IEEE 1101.2 conduction-cooled cards
    • Optional board spacing available upon request
  • Backplane is PICMG 2.0 cPCI complaint with five-row, 220-pinned J1, J2 connectors in all slots. Any of the J2 pins can be routed to the front I/O panel.

    Optional 64-bit cPCI per PICMG 2.0 also available.

Specifications

Dimensions
  • 9.00″ W x 8.25″ H x 7.50″ L
Operating Temperature
  • -40°C to +80°C
Storage Temperature
  • -55°C to 125°C
Fluids
  • Polyalphaolefin (PAO) per MIL-PRF-87252C
  • Propylene Glycol/Water (PGW)
  • Ethylene Glycol/Water (EGW)
Burst Pressure
  • Tested to 429PSI using PAO fluid held for 30 minutes
Power Supply
  • Input power +28 V nominal (21 to 35 V steady state) transients 16 to 80 VDC per MIL-STD-704D
  • Output power:
Output 1 2 Optional
Volts DC +3.3 +5 +12 -12
Amps 1.0 30 0.5 0.5
Line/Load regulation % 0.06 0.2 0.02 0.02
Ripple/Noise (P-P mV)  150 mV 150 mV 100 mV 100 mV
Vibration
  • MIL-STD-810E Method 514.5 to 514.5C Procedure 1, Cat. 4 propeller, Cat. 5 jet aircraft, Cat. 6 helicopter
  • 0.1 g2/Hz, 15 – 2000 Hz hard mount
Acceleration
  • MIL-STD810E Method 5013.5
Shock
  • MIL-STD-810E Method 516.5 Procedure 1 20g, 1/2 sine, 11 msec
Altitude
  • 50,000 feet per MIL-STD-810E Method 500.4, Procedure 1,11 & 111
Humidity
  • MIL-STD810E Method 507.4
Fungus
  • MIL-STD810E Method 508.5
Salt Fog
  • MIL-STD810E Method 509.4
Explosive Atmosphere
  • MIL-STD810E Method 511.4