1 ATR Long 4-Slot VME/VPX or cPCI Forced-Air Conduction-Cooled

Macrolink’s ML1000 Long FACC is a conduction-cooled, 4-Slot or redundant 2-Slot VME/VPX or cPCI rugged enclosure designed for avionics and ground vehicle applications. Supports one or two 100,000 cycle SSD removable drive shuttles for secure date storage. The structure is capable of withstanding extreme environmental conditions of altitude, temperature, humidity, shock, vibration, EMI, and chemical exposure.

ML-1000 Long FACC Series Forced Air Conduction-Cooled Air Transport Rack Electronic Equipment Enclosure

  • ML1000 Long FACC is optimized to provide maximum strength with minimum weight. Lightweight aluminum 6061-T6, brazed per MIL-B-7883, minimizes the need for fasteners and provides robust Faraday shielding protection for electronic payload. Removable panels use stainless steel captive hardware and self-locking helicoils for maximum shock and vibration security. Modular power supply supports low Mean Time To Repair service.
  • Conduction cooling is through precision-machined card guides in the sidewalls. A 63 micro-inch surface finish reduces the thermal resistance path between mounting interfaces. Both circuit card assemblies and power supply heat are conducted through the brazed inner structural member to the internal heat exchanger. Two high-efficiency fans circulate ambient air through the heat exchanger.

    Macrolink’s in-house thermal analysis capabilities dramatically shorten the delivery time of any completed system by eliminating the risk of project failure due to overheating. Through analyzation of a variety of heat transfer regimes – conduction, convection (natural, mixed, forced), conjugate (simultaneous conduction and convection), radiation – and implementation, a solution is presented based on specific board requirements, assuring early in the design process that the product’s thermal requirements have been satisfied.

    Native, solid-model CAD geometry is utilized to produce a selection of shaded display, particle trace animation, and clipping planes to optimize thermal performance and validate design.ml1000lfacc_rail

  • The integral front panel accommodates MIL style M38999 connectors with high-density internal connectors and is customized, along with the backplane, to meet each customer’s unique requirements. Two removable solid-state or rotating media disk drives canisters are accessible from the front panel.
  • The enclosure is chromate conversion coated per MIL-C-5541 Class 1A for maximum protection against corrosion on all surfaces, then the exterior is epoxy painted to military standards and colors per MIL-HDBK-1568. All materials and finishes are fungus resistant.

    ml1000lfacc_rsd

  • The ML1000FACC accommodates four standard 3U VME/VPX or cPCI boards with 0.8″ pitch:

    • IEEE 1101.2 conduction-cooled cards
    • Optional board spacing available upon request
  • Optional VME/VPX 3U backplane

Tested Specifications

Dimensions
  • 10.125″ W x 7.625″ H x 19.62″ L
Weight
  • 46 lbs.
Operating Temperature
  • -54°C to +55°C
Storage Temperature
  • -57°C to +95°C
Power supply specifications
  • Input power 115 VAC nominal
  • EMI/RFI meets emissions and susceptibility per MIL-STD-461C, CE102, CS06, CS101, CS114, CS115, CS116, RE02, RE102 and RE103
  • Output power:
Output 1 2 3 4 Optional
Volts DC +3.3 +5 +12 -12
Amps 14 26 6 0.5
Line/Load regulation % ±5 ±5 ±5 ±5
Ripple/Noise (P-P mV)  50 mV 50 mV 50 mV 50 mV
EMI/RFI
  • MIL-STD-462
  • CE102, CS101, CS114, CS115, CS116, RE102, RS103
Temperature
Altitude
  • MIL-STD-810, Method 520.2 Procedure III
Humidity
  • MIL-STD-810, Method 502.2 (5 cycles)
Sand and Dust
  • MIL-STD-810, Method 510.4 Procedure I
Salt Fog
  • MIL-STD-810, Method 509.4
Operational Shock
  • MIL-STD-810, Method 516.5 Procedure I
    Three 20g 11 ms shocks in opposite directions along each axes
Crash Safety
  • MIL-STD-810, Method 516.5 Procedure V
Vibration
  • MIL-STD-810, Method 514.5 paragraph 4.2
Explosive
Decompression
  • MIL-STD-810, Method 500.4 Procedure IV
Explosive
Atmosphere
  • MIL-STD-810, Method 511.4 Procedure I