25 Industrial Boulevard
Medford, NY 11763
Director of Business Development
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Macrolink’s ML1000TFACC is a conduction-cooled, 8-Slot 3U VME/VPX or cPCI rugged enclosure designed for avionics and ground vehicle applications. The structure is capable of withstanding extreme environmental conditions of altitude, temperature, humidity, shock, vibration, EMI, and chemical exposure.
Macrolink’s in-house thermal analysis capabilities dramatically shorten the delivery time of any completed system by eliminating the risk of project failure due to overheating. Through analyzation of a variety of heat transfer regimes – conduction, convection (natural, mixed, forced), conjugate (simultaneous conduction and convection), radiation – and implementation, a solution is presented based on specific board requirements, assuring early in the design process that the product’s thermal requirements have been satisfied.
Native, solid-model CAD geometry is utilized to produce a selection of shaded display, particle trace animation, and clipping planes to optimize thermal performance and validate design.
The integral front panel accommodates MIL style M38999 connectors with high-density internal connectors and is customized, along with the backplane, to meet each customer’s unique requirements. Front panel options include:
The ML1000TFACC accommodates 8 standard VME/VPX or cPCI boards, including a power supply, with 0.8″ pitch:
Backplane is cPCI complaint, PICMG 2.0 R3.0, with five-row, 160-pinned J1, J2 connectors with P0 80 pin connectors in all slots. Any of the pins in rows A and C and user defined. Pins in rows Z and D of the J2 connectors as well as the 95 I/O pins on P0 connectors can be routed to the front I/O panel.
Optional VME per ANSI/VITA 1.1-1997 standard also available.
|Power supply specifications||